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<title>IT Industry Today: 32nm News</title>
<link>http://it.einnews.com/news/32nm</link><description>Constantly updated news and information about it industry.</description><item>
<title>SMIC to move 65nm into production in 2008; 32nm to follow in 2009</title>
<link>http://it.einnews.com/news.php?wid=186664499</link>
<pubDate>5 Sep 2008 14:30 GMT</pubDate>
<description>
...  transition to 65nm will be made by the end of this year, and that 32nm production is also expected to follow next year. According to Eric Guo, director of  ...
</description>
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<title>Intel Havendale CPUs with integrated graphics delayed to January 2010</title>
<link>http://it.einnews.com/news.php?wid=186610440</link>
<pubDate>5 Sep 2008 03:29 GMT</pubDate>
<description>
...  are delayed to January 2010. Furthermore, the slide also suggests Intel may delay the 32nm Sandy Bridge architecture to ensure sufficient Nehalem lifecycle. ...
</description>
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<title>Germany funds 32 nm, mask lithography project for next generation chip production</title>
<link>http://it.einnews.com/news.php?wid=186549769</link>
<pubDate>4 Sep 2008 18:33 GMT</pubDate>
<description>
...  measurement processes for next-generation chip production. The project CDuR32 (Critical Dimensions and Registration for 32nm Mask Lithography) is funded in part by the German Federal Ministry of Education and  ...
</description>
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<title>Super-reliable Cu interconnects with Low-resistivity by New Ruthenium (Ru) barrier-metal structure for dependable LSI systems</title>
<link>http://it.einnews.com/news.php?wid=186461382</link>
<pubDate>4 Sep 2008 10:29 GMT</pubDate>
<description>
...  NEC, developed super-reliable Cu interconnects with low resistivity for dependable LSI systems such as 32nm-node LSIs and/or automobile applications. Implementation of a new Ruthenium (Ru) barrier structure is a  ...
</description>
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<title>Chartered confident about its cutting-edge process nodes offering</title>
<link>http://it.einnews.com/news.php?wid=186428832</link>
<pubDate>4 Sep 2008 05:16 GMT</pubDate>
<description>
...  to be initiated in the first quarter of 2009, he updated. For progress on 32nm, Hsia indicated that Chartered has adopted high-k/metal gate materials for production, resulting in 40%  ...
</description>
</item><item>
<title>Spansion to incorporate NAND flash to handsets</title>
<link>http://it.einnews.com/news.php?wid=186412575</link>
<pubDate>4 Sep 2008 02:32 GMT</pubDate>
<description>
...  mid 09. Over time, we are looking into shifting the Ornand2 devices to a 32nm process,&quot; he noted. Cambou said he expects to have a &quot;sweet spot&quot; for the  ...
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<title>Cymer Launches Argon Fluoride Laser Source for 32 Nanometer Dry Lithography</title>
<link>http://it.einnews.com/news.php?wid=186360166</link>
<pubDate>3 Sep 2008 19:55 GMT</pubDate>
<description>
... Cymer Launches Argon Fluoride Laser Source for 32 Nanometer Dry Lithography ( Nanowerk News ) Cymer,  ...  applications.&quot; As lithography is deployed into full 32nm production environments, Cymer&apos;s XLR 500d will bring  ...
</description>
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<title>Chartered follows rival TSMC into 40nm space</title>
<link>http://it.einnews.com/news.php?wid=186354997</link>
<pubDate>3 Sep 2008 19:20 GMT</pubDate>
<description>
...  pursue a 40nm half-node, or if it will attempt to match Intel on a 45nm-32nm shrink. Industry watchers believe that TSMC will move from 45nm to 40nm due to  ...
</description>
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<title>Cymer Unveils New XLR 500d, Enabling High Productivity Dry ArF Lithography</title>
<link>http://it.einnews.com/news.php?wid=186319347</link>
<pubDate>3 Sep 2008 15:35 GMT</pubDate>
<description>
...  argon fluoride (ArF) laser light source for 32 nanometer (nm) dry lithography. Expanding Cymer&apos;s market leadership  ...  applications.&quot; As lithography is deployed into full 32nm production environments, Cymer&apos;s XLR 500d will bring  ...
</description>
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<title>CVD Film extends gap-fill technology to 32 nm and beyond.</title>
<link>http://it.einnews.com/news.php?wid=186309357</link>
<pubDate>3 Sep 2008 14:36 GMT</pubDate>
<description>
... Applied Materials&apos; New eHARP System Extends Production-Proven STI Gap-Fill Technology to 32nm and Beyond SANTA CLARA, Calif.--Applied Materials, Inc. today announced its Applied Producer eHARP(TM) system,  ...
</description>
</item><item>
<title>PVD System deposits copper barrier for memory chips.</title>
<link>http://it.einnews.com/news.php?wid=186304566</link>
<pubDate>3 Sep 2008 14:19 GMT</pubDate>
<description>
...  single-system solution that allows memory makers to realize high device yields down to the 32nm technology node and beyond.&quot; The Applied Extensa system&apos;s outstanding performance, already proven at multiple  ...
</description>
</item><item>
<title>TSMC to Add HKMG Technology to 32nm Process</title>
<link>http://it.einnews.com/news.php?wid=186247880</link>
<pubDate>3 Sep 2008 08:24 GMT</pubDate>
<description>
... TSMC to Add HKMG Technology to 32nm Process Taipei, Sept. 3, 2008 (CENS)--Taiwan Semiconductor Manufacturing Co. (TSMC) plans to add high-K  ...
</description>
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<title>Chartered expected to display half-node 40nm process at technology forum in Taiwan</title>
<link>http://it.einnews.com/news.php?wid=186245963</link>
<pubDate>3 Sep 2008 08:15 GMT</pubDate>
<description>
...  Intel&apos;s CPU roadmap. Given that Intel is expected to move its CPU production to 32nm, graphics chips that are fabricated under 45nm implies that a generation lag will be  ...
</description>
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<title>VeriFone Announces Appointment of Robert Dykes as Chief Financial Officer</title>
<link>http://it.einnews.com/news.php?wid=186192659</link>
<pubDate>2 Sep 2008 23:13 GMT</pubDate>
<description>
...  30 patents on the technology, developed test chips in multiple technologies from 90nm to 32nm, and has established global R&amp;D, engineering and support centers in Europe, Asia and North  ...
</description>
</item><item>
<title>Innovative Silicon Names Michael Van Buskirk Senior Vice President of Engineering and Operations</title>
<link>http://it.einnews.com/news.php?wid=186180462</link>
<pubDate>2 Sep 2008 21:55 GMT</pubDate>
<description>
...  30 patents on the technology, developed test chips in multiple technologies from 90nm to 32nm, and has established global R&amp;D, engineering and support centers in Europe, Asia and North  ...
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