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<title>IT Industry Today: Low-k Dielectric News</title>
<link>http://it.einnews.com/news/low-k</link><description>Constantly updated news and information about it industry.</description><item>
<title>A New &quot;Direct Low-k/Cu Dual-Damascene Contact lines&quot; is developed first time in the world for Leading-edge LSI, boosting up performance of CMOS devices by lowering the contact resistance and the parasitic capacitance especially fo</title>
<link>http://it.einnews.com/news.php?wid=186616284</link>
<pubDate>5 Sep 2008 04:25 GMT</pubDate>
<description>
...  capacitance to the conventional ones. Durable double-layered low-k structure is implemented by using our original  ...  (SiO , k=4.1), was implemented to pre-metal dielectric (PMD) film. Here, narrow-pitched gaps of CMOS  ...
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